Japan Allocates $4.9 Billion in Subsidies for Construction of TSMC Chip Plant

Published on February 26, 2024

The Japanese government has pledged to provide 730 billion yen (around $4.85 billion) in extra subsidies for the construction of chipmaker Taiwan Semiconductor Manufacturing Co.’s (TSMC) second plant in Japan. The subsidies were announced following the opening ceremony of TSMC’s first plant in Japan’s Kumamoto Prefecture on Feb. 24, which was attended by Japanese Minister of Economy, Trade and Industry Ken Saito. During the ceremony, TSMC also unveiled its plan to build a second fab in Kumamoto Prefecture, which it said will commence construction by the end of 2024 and begin operation by the end of 2027. “The chips will be more advanced than the first factory and can be used for AI and autonomous driving, and will ensure we have [a] stable supply of semiconductors in Japan,” Mr. Saito told reporters following the event....

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